APCS – Advanced Packaging for Compound Semiconductor Applications
This workshop aims to bring together an array of electronics packaging experts and practitioners to present a comprehensive review of advanced packaging technologies applied to areas of power electronics, photonics, RF/Microwave and sensing, where compound semiconductors are already making an impact.
Date: Thursday 8 February 2018, 09.00-16.00
Venue: The Studio, Cannon Street, Birmingham, B2 5EP
With the emergence of wide bandgap(e.g. SiC, InP and GaN), the standard packaging and interconnection technologies have become the limiting factor determining the performance and efficiency of the new semiconductor components. In order to achieve the dramatic improvements that are required in the performance, reliability and cost-effectiveness of future electronics systems, an integrated approach based on advanced packaging technologies of new generations of compound semiconductor devices with integrated functionality, standard interfaces, suitability for mass production and application versatility is required.
This workshop aims to bring together an array of electronics packaging experts and practitioners to present a comprehensive review of advanced packaging technologies applied to areas of power electronics,, RF/Microwave and sensing, where compound semiconductors are already making an impact.
|09:00||Registration & Networking|
|09:30||Welcome, Introduction and Briefings|
|09:45||Session One: Do CS applications need Advanced Packaging|
|Covering: Power Devices, Photonics & RF/Microwave Applications|
|09:45||1.1: "Packaging High temperature SiC Devices" - Liam Mills, TT Semelab|
|10:10||1.2: "Packaging Photonic Devices" - Mike Wale, Oclaro|
|10:35||1.3: "Packaging RF and Microwave Components" - TBA|
|11:30||Session Two: Equipment, Materials and Processes|
|Covering: Component soldering, Laser bonding, and the Compound Semiconductor Applications Catapult|
|11:30||2.1: "Impact of Advanced Packaging on Component Soldering" - Andy Longford, PandA Europe|
|1150||2.2: "Laser Bonding" - F&K Delvotec|
|12:10||2.3: "Flip Chip Bonding" - Caroline Avriller - SET|
|12:30||2.4: "The Compound Semiconductor Applications Catapult" - Alastair Mc Gibbon, CSA Catapult|
|12:50||Lunch Break - Networking|
|13:50||Session Three: "Open Floor"- Panel Session|
|14:30||Session Four: Case Studies|
|14:30||4.1: "GaAs Sensor /Flip Chip" - Andreas Schneider, STFC RAL|
|14:45||4.2: "Embedded CS components" - TBA, TTPi|
|15:20||4.3: "Press Pack" TBA - Power Electronics Centre|
|15:35||4.4: Case Study 4 - TBA|
|15:50||Summary & Wrap up|
Who Should Attend:
End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Reliability and Quality Engineers, Failure Analysis Engineer, Process Engineers, Product Designers & Students etc.
Join us at this prestigious one day event to learn, network and source in the field of packaging for Compound Semiconductor Applications (CSA).
The event is open to all including non members, the following delegate rates apply:
IMAPS-UK and KTN Members: £50 +VAT
Non Member: £80 +VAT
All prices plus VAT are inclusive of lunch & refreshments.
ALL BOOKINGS MUST BE DONE ON AN INDIVIDUAL BASIS IN ORDER FOR DELEGATES TO BE ABLE TO ACCESS THE EVENT AND RECEIVE EVENT INFORMATION, INCLUDING ACCESS TO POST EVENT DOWNLOADS.
WE THANK YOU FOR YOUR CO-OPERATION WITH THIS.
Telephone: + 44 (0)131 202 9004