APCS – Advanced Packaging for Compound Semiconductor Applications
8 Feb

8 Feb to 8 Feb

This workshop aims to bring together an array of electronics packaging experts and practitioners to present a comprehensive review of advanced packaging technologies applied to areas of power electronics, photonics, RF/Microwave and sensing, where compound semiconductors are already making an impact.

Date: Thursday 8 February 2018, 09.00-16.00

Venue: The Studio, Cannon Street, Birmingham, B2 5EP

With the emergence of wide bandgap semiconductors (e.g. SiC, InP and GaN), the standard electronics packaging and interconnection technologies have become the limiting factor determining the performance and efficiency of the new semiconductor components. In order to achieve the dramatic improvements that are required in the performance, reliability and cost-effectiveness of future electronics systems, an integrated approach based on advanced packaging technologies of new generations of compound semiconductor devices with integrated functionality, standard interfaces, suitability for mass production and application versatility is required.

This workshop aims to bring together an array of electronics packaging experts and practitioners to present a comprehensive review of advanced packaging technologies applied to areas of power electronics, photonics, RF/Microwave and sensing, where compound semiconductors are already making an impact.

Agenda:

StartDetails
09:00Registration & Networking
09:30Welcome, Introduction and Briefings
09:45Session One: Do CS applications need Advanced Packaging
Covering: Power Devices, Photonics & RF/Microwave Applications
09:451.1: "Packaging High temperature SiC Devices" - Liam Mills, TT Semelab
10:101.2: "Packaging Photonic Devices" - Mike Wale, Oclaro
10:351.3: "Packaging RF and Microwave Components" - TBA
11:00Networking Break
11:30Session Two: Equipment, Materials and Processes
Covering: Component soldering, Laser bonding, and the Compound Semiconductor Applications Catapult
11:302.1: "Impact of Advanced Packaging on Component Soldering" - Andy Longford, PandA Europe
11502.2: "Laser Bonding" - F&K Delvotec
12:102.3: "Flip Chip Bonding" - Caroline Avriller - SET
12:302.4: "The Compound Semiconductor Applications Catapult" - Alastair Mc Gibbon, CSA Catapult
12:50Lunch Break - Networking
13:50Session Three: "Open Floor"- Panel Session
14:30Session Four: Case Studies
14:304.1: "GaAs Sensor /Flip Chip" - Andreas Schneider, STFC RAL
14:454.2: "Embedded CS components" - TBA, TTPi
15:00Networking Break
15:204.3: "Press Pack" TBA - Power Electronics Centre
15:354.4: Case Study 4 - TBA
15:50Summary & Wrap up
16:00Close

Who Should Attend:

End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Reliability and Quality Engineers, Failure Analysis Engineer, Process Engineers, Product Designers & Students etc.

Delegate Bookings:

Join us at this prestigious one day event to learn, network and source in the field of packaging for Compound Semiconductor Applications (CSA).

The event is open to all including non members, the following delegate rates apply:

IMAPS-UK and KTN Members: £50 +VAT
Non Member: £80 +VAT

All prices plus VAT are inclusive of lunch & refreshments.

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BOOKING NOTICE:

ALL BOOKINGS MUST BE DONE ON AN INDIVIDUAL BASIS IN ORDER FOR DELEGATES TO BE ABLE TO ACCESS THE EVENT AND RECEIVE EVENT INFORMATION, INCLUDING ACCESS TO POST EVENT DOWNLOADS.
WE THANK YOU FOR YOUR CO-OPERATION WITH THIS.

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Book NOW

For further information, please contact:

IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004
Email: andy.longford@imaps.org.uk

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